Electron microscopes


         HRSEM (Equipment: JSM-6700 Field Emission Scanning Electron Microscope)

         FIB (Raith ionLine)



         Molecular Imaging PicoSPM II system

         Veeco NanoScope IV MultiMode AFM

         Variable Temperature Ultra-High Vacuum Scanning Probe Microscopy System


Optical microscopy

Metallurgical Confocal microscope (LEXT)


Ebeam Lithography

         E-beam lithography (Raith 150 Ultra High Precision E-Beam Lithography and Metrology System)

         JEOL JSM-6400 Research Grade SEM



         Contact lithography (Suss MA6, MJB3)

         Direct laser writing (Heidelberg)

         Photomask preparation (Heidelberg)

         Nanoimprint lithography (S.E.T. FC-150)


Thin film deposition/etching/characterization

         FIB deposition

         E-beam deposition (VST)

         Thermal evaporation (VST)

         RF sputtering (MRC)

         RIE Etching

         DRIE etching

         Wet etching

         Wet and dry Cleaning


  1. Profile/Step height
  2. Optical Microscopes
  3. LEXT
  4. Spectroscopic Ellipsometer
  5. Spectroscopic Reflectometer  



         Dicing (Disco DAD 3350)

         Wire Bonding

         Precision Diamond Scriber (ATV)


For more details, please contact Mr. Mark Oksman ( or Dr. Nava Ariel-Sternberg (



Unless otherwise noted, processes can be performed either by lab personnel (for extra fee) or by trained users.

For most processes the user must be familiar with the equipment to operate it by him/herself.



         With solvents

         With acid and basic solutions (RCA, Piranha, Nanostrip)



         Contact lithography using MA6 and MJB3 Karl Suss Mask Aligners:

         Mask sizes: 3"x3", 4"x4", 5"x5", 7"x7"

         Substrate sizes: small pieces, wafers 3", 4", 6", 8" diameter (for 8" wafers exposed area will be only 6")

         Direct laser writing on big substrates

         Nanoimprint lithography (S.E.T. FC-150)


Photomask Preparation

Mask preparation by Heidelberg Instruments DWL66 Laser Writer, 1 micron resolution, 4"x4" and 5"x5" Soda Lime or Quartz Low Reflective Chrome photomasks.


Film deposition

         PVD by e-beam evaporation and by RF Sputtering.




         Chemical wet etching of Cr, Au, Au, Ti films

         Anisotropic Si wet etching

         Plasma Etching of SiO2, Si3N4, Photoresist films, Quartz and Fused Silica bulk samples by HDP/RIE Nextral 860. Sample size: from small pieces to 8" wafers

         DRIE of Si by Bosch process in ICP DRIE PlasmaTherm SLR 770 machine

         Etching of small Si features for nanophotonics by RIE process

         Photoresist ashing

         FIB etching



         Profile/Step height

         Optical Microscopes

         Spectroscopic Ellipsometer

         Spectroscopic Reflectometer


Dicing of Si and LiNbO3 samples up to 6" diameter by Disco DAD 3350 dicing saw.