Equipment

  

 

Electron microscopes

·         ESEM

·         HRSEM (Equipment: JSM-6700 Field Emission Scanning Electron Microscope)

·         FIB (Raith ionLine)

 

AFM/STM

·         Molecular Imaging PicoSPM II system

·         Veeco NanoScope IV MultiMode AFM

·         Variable Temperature Ultra-High Vacuum Scanning Probe Microscopy System

 

Optical microscopy

Metallurgical Confocal microscope (LEXT)

 

Ebeam Lithography

·         E-beam lithography (Raith 150 Ultra High Precision E-Beam Lithography and Metrology System)

·         JEOL JSM-6400 Research Grade SEM

 

Photolithography

·         Contact lithography (Suss MA6, MJB3)

·         Direct laser writing (Heidelberg)

·         Photomask preparation (Heidelberg)

·         Nanoimprint lithography (S.E.T. FC-150)

 

Thin film deposition/etching/characterization

·         FIB deposition

·         E-beam deposition (VST)

·         Thermal evaporation (VST)

·         RF sputtering (MRC)

·         RIE Etching

·         DRIE etching

·         Wet etching

·         Wet and dry Cleaning

·         Measurements:

  1. Profile/Step height
  2. Optical Microscopes
  3. LEXT
  4. Spectroscopic Ellipsometer
  5. Spectroscopic Reflectometer  

 

Backend

·         Dicing (Disco DAD 3350)

·         Wire Bonding

·         Precision Diamond Scriber (ATV)

 

For more details, please contact Mr. Mark Oksman (oksman@post.tau.ac.il) or Dr. Nava Ariel-Sternberg (anava@tauex.tau.ac.il)

 

Processes

Unless otherwise noted, processes can be performed either by lab personnel (for extra fee) or by trained users.

For most processes the user must be familiar with the equipment to operate it by him/herself.

 

Cleaning

·         With solvents

·         With acid and basic solutions (RCA, Piranha, Nanostrip)

 

Photolithography

·         Contact lithography using MA6 and MJB3 Karl Suss Mask Aligners:

·         Mask sizes: 3"x3", 4"x4", 5"x5", 7"x7"

·         Substrate sizes: small pieces, wafers 3", 4", 6", 8" diameter (for 8" wafers exposed area will be only 6")

·         Direct laser writing on big substrates

·         Nanoimprint lithography (S.E.T. FC-150)

 

Photomask Preparation

Mask preparation by Heidelberg Instruments DWL66 Laser Writer, 1 micron resolution, 4"x4" and 5"x5" Soda Lime or Quartz Low Reflective Chrome photomasks.

 

Film deposition

·         PVD by e-beam evaporation and by RF Sputtering.

·         PECVD

·         Electroplating

 

Etching

·         Chemical wet etching of Cr, Au, Au, Ti films

·         Anisotropic Si wet etching

·         Plasma Etching of SiO2, Si3N4, Photoresist films, Quartz and Fused Silica bulk samples by HDP/RIE Nextral 860. Sample size: from small pieces to 8" wafers

·         DRIE of Si by Bosch process in ICP DRIE PlasmaTherm SLR 770 machine

·         Etching of small Si features for nanophotonics by RIE process

·         Photoresist ashing

·         FIB etching

 

Measurements

·         Profile/Step height

·         Optical Microscopes

·         Spectroscopic Ellipsometer

·         Spectroscopic Reflectometer

 

Dicing

Dicing of Si and LiNbO3 samples up to 6" diameter by Disco DAD 3350 dicing saw.