email: gileadi@post.tau.ac.il
Voice: 972-3-6408694
Fax: 972-3-6409293
Building: Ornstein
Room: 307

Fundamental:

  • Structure of the metal/solution interface.
  • Specific adsorption, the configuration of adsorbed species at the interface.
  • Evaluation of the mechanism of anomalous alloy deposition.
  • Studying the properties of non-aqueous and mixed solvents.

Applied:

  • Electroplating of Ni/W and similar alloys for protection (of turbine blades)
    against high-temperature corrosion and erosion.
  • Electroplating of thin-film barrier layers for the micro-electronic industry.
  • Improving methods of plating copper and its alloys into sub-micron features
    for use in ULSI technology.
  • Development of methods for the electroplating of magnetic materials for application in Micro-Electro-Mechanical-Systems (MEMS).


Papers related to work with the Electrochemical QCM

V. Tsionsky and E. Gileadi, Use of the Quartz Crystal Microbalance for the Study of Adsorption from the Gas Phase, Langmuir 10, (1994), 2830.

V. Tsionsky M. Urbakh, L Daikhin and E. Gileadi, Behavior of the Quartz Crystal Microbalance in Non-Adsorbed Gases at High Pressure Langmuir, 11 (1995), 674.

V. Tsionsky L. Daikhin and E. Gileadi, Weighing Ions in Solution with the Quartz Crystal Microbalance, J. Electrochem. Soc., 142, (1995), L-233.

V. Tsionsky L. Daikhin and E. Gileadi, Response of the Quartz Crystal Microbalance for Gold Electrodes in the Double-Layer Region, J. Electrochem. Soc., 143, (1996), 2240.

G. Zilberman, V. Tsionsky and E. Gileadi, Response of the EQCM for Specific Adsorption on Gold Electrodes: The Adsorption of Pyridine and Benzene, Canadian J. of Chemistry, 75, (1997), 1674.

V. Tsionsky, L. Daikhin, G. Zilberman and E. Gileadi, Response of the EQCM for Electrostatic and Specific Adsorption on Gold and Silver Electrodes, Faraday Discussions 107, (1997) 337.

G. Zilberman, V. Tsionsky and E. Gileadi, Solvent Structure at the Metal/Solution Interface, Electrochim. Acta, 45, (2000), 3473.

E. Gileadi and V. Tsionsky, Studies of Electroplating Using the EQCM. Part I: Copper and Silver on Gold, J. Electrochem. Soc., 147, (2000), 574.

L. Daikhin, E. Gileadi, V. Tsionsky, M. Urbakh and G. Zilberman, Slippage at Adsorbate-Electrolyte Interfaces. Response of EQCM to Adsorption, Electrochim. Acta, 45, (2000), 3615.

V. Tsionsky and E. Gileadi, Early Stages in the Electroplating of Copper and Silver on Gold, Materials Science and Engineering  - A, (2000), in press.

G. Zilberman., The Adsorption of t-Butanol on Gold in Electrochemical and EQCM Studies, J Electroanal. Chem., in press.


Recent papers related to metal and alloy deposition

A. Vaskevich, M. Rosenblum and E. Gileadi, Underpotential-Overpotential Transition of Ag Overlayer on Pt. Part I: Formation of a Pt/Ag Surface Alloy. J. Electroanal. Chem., 167, (1995), 383.

A. Vaskevich, M. Rosenblum and E. Gileadi, UPD-OPD Transition in Ag Overlayer on Pt: Part II Reversible and Irreversible Rearrangement in Silver Adlayers, J. Electroanal. Chem., 412, (1996), 117.

A. Vaskevich and E. Gileadi, UPD-OPD Transition of Ag overlayer on Pt. Part 3: Influence of the Rearrangement of the Overlayer Structure on Blocking of Hydrogen UPD, J. Electroanal. Chem. 442, (1998), 147.

E. Gileadi and V. Tsionsky, Studies of Electroplating Using the EQCM, Part I: Copper and Silver on Gold, J. Electrochem. Soc., 147 (2000), 574.

O. Younes and E. Gileadi, Electroplating of High Tungsten Content Ni/W Alloys, Electrochem. and Solid-State Letters, 3 (12) (2000), 545.

V. Tsionsky and E. Gileadi, Early stages of the Electroplating of Copper and Silver on Gold, Materials Science and Engineering-A (2000), in press.

O. Younes, Y. Shacham-Diamand and E. Gileadi, Proc. Adv. Melallization Society, (2001), in press.

O. Younes, L. Zhu, Ya Rosenberg, Y. Shacham-Diamand and E. Gileadi, Electroplating of Amorphous thin films of Tungsten-Nickel Alloys.